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  • Epoxy Molding Compound Development for Improved MSL1 Delamination . . .
    During MSL1, the combination of rapid moisture absorption, materials mismatch, and interface adhesion degradation can result to delamination at critical interfaces within the package
  • Leadframe Solderability Issues in Power Semiconductors
    An emerging failure mode is one of incomplete wetting onto the leadframe, leading to failures at the sites where solder has failed to flow over the silver plated area completely – “delamination sites” – (below)
  • Electrolytic removal of epoxy molding compound on transistor packages . . .
    Actually Electrolytic Deflashing is good but some certain material cannot be good, as it will cause delamination especially on Ag plated leads I've done a lot of study and evaluation on this but until we found out that Electrolytic deflash is one cause of delamination
  • Reliability Improvement Technologies for Epoxy Molding Compounds on . . .
    In addition, to reduce costs, we need to eliminate moisture-proof packaging not only for built-in semiconductors but for semi-conductors for consumer use Thus, we need to improve the moisture sensitivity level (MSL) against water absorption at reflow
  • Adhesion Characteristics of Epoxy Molding Compound and Copper Leadframe . . .
    Moisture can reduce adhesion by three mechanisms: (1) Absorption and diffusion of moisture in the mold compound; aggregates at the interface and degrades interfacial adhesion by bonding to the polymer chains [4, 6], (2) absorbed moisture can change thermo-mechanical properties like (E, CTE and Tg) of the mold compound
  • Dynacraft Industries - Index
    MSL or Moisture Sensitivity Level is an electronic standard for the time period in which a moisture sensitive device can be exposed to ambient room temperature The trapped moisture can cause delamination DCI has developed technology that can improve the MSL performance by at least 1 Level
  • Moisture sensitivity level - MSL - SURFACE MOUNT PROCESS
    The expansion of trapped moisture can result in interfacial separation, known as delamination, of the mold compound from the die or lead-frame, wire bond damage, die damage, and internal cracks In the most severe cases, the component will bulge and pop, which is known as the 'popcorn' effect
  • Chapter 14 Moisture Sensitivity Level (MSL) Capability of . . . - Springer
    othermal stresses act together to cause delamination and cracking of the mold compound Sometimes a doming effect can be seen on the outside of the package If the pres-sure exceeds the flexural strength of the mold compound, a crack initiates The crack may propagate to the surfac
  • Moisture Sensitivity Level (MSL) Packaging Evaluation - NASA
    Under certain conditions, this pressure can cause internal delamination of the packaging materials from the die and or leadframe substrate, internal cracks that do not extend to the outside of the package, bond damage, wire necking, bond lifting, die lifting, thin film cracking, or cratering beneath the bonds
  • Correlation between Surface Texturing on Pre-Plated Leadframe and . . .
    automotive devices can cause serious reliability issue and degrade the package quality This study aims to evaluate and understand the correlation between surface texturing procedure (roughening) on pre-plated leadframe (PPF) and delamination phenomenon in integrated circuit packaging





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